PCB TrainBot
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Single & Double sided PTH |
4-6-8-10-12 Layers |
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Laminate thickness |
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0.8,1.2,1.6,2.4,3.2 mm | ||
Laminate types: FR4, Polyimide, PTFE, & others, ask us to quote | 18 microns | 18 microns | ||
1 oz Cu thickness | 35 microns | 35 microns | ||
2 oz Cu thickness | 70 microns | 70 microns | ||
3 oz Cu thickness | 105 microns | n/a | ||
Copper thickness (inner-cores), start = finish thickness | n/a | 35 microns | ||
Solder resist: (photo-image), green, red, blue, white ,black | x 2 | x 2 | ||
Legend: white, yellow | x 2 | x 2 | ||
Nos. of holes | No limit | No limit | ||
Min finished hole size after Cu plate (0.8mm and 1.6mm laminate) | 0.20mm | 0.20mm | ||
Min finished hole size after Cu plate (2.4mm laminate only) | 0.30mm | n/a | ||
Min finished hole size (1.5mm thick aluminium base only) | 0.60mm | n/a | ||
Profile complexity | No limit | No limit | ||
Surface Finish | Immersion Silver or ENIG (Au/Ni) | Immersion Silver or ENIG (Au/Ni) | ||
Gold (electrolytic) | n/a | n/a | ||
Electrical test | Included (except PCB Train Express 2 lyrs) | Included, all services | ||
Min track & gap (35 micron / 1oz Cu thickness) | 0.125mm | 0.125mm | ||
Min track & gap (70 micron / 2oz Cu thickness) | 0.250mm | n/a | ||
Solder resist to copper pad clearance | 0.125mm | 0.125mm | ||
Copper pad to hole | 0.125mm | 0.125mm | ||
Copper track to copper plane clearance within a ground plane (35 micron / 1oz Cu thickness) Copper track to copper plane clearance within a ground plane (70 micron / 2oz Cu thickness) |
0.125mm
0.250mm |
0.125mm
0.250mm |
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Minimum board size | 10mm x 10mm | 10mm x 10mm | ||
Maximum board size | 550mm x 400mm | 550mm x 400mm | ||
Mechanical | No scoring. No chamfering. No countersinking. No rebating. 2.0mm standard router. |
No scoring. No chamfering. No countersinking. No rebating. 2.0mm standard router. |
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Legend text line width Legend character height Legend to copper pad clearance |
50 micron minimum, 150 micron typical, 0.5mm minimum 50 micron minimum, 125 micron typical |
50 micron minimum, 150 micron typical, 0.5mm minimum 50 micron minimum, 125 micron typical |
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Drill hole annular ring insulation clearance to inner layer copper (min) | n/a | 0.25mm min. | ||
Mechanical edge to copper track clearance Profile tolerance | 0.25mm min. +/- 0.2mm | 0.25mm min. +/- 0.2mm | ||
Dielectric constant (Dk) of FR4 cores Dielectric constant (Dk) of FR4 prepregs |
4.55 4.2 |
4.55 4.2 |
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Multi-layer builds and dimensions | Multi-layer builds | |||
If your requirements exceed PCB Train specifications | Ask us to quote, complete the form below | Ask us to quote, complete the form below |