.....take a look at NEW PCB Train services....8 layers (1.6 mm thick).....PCB Train Express 0.8mm service.......2 layer PTH 2.4 mm thick service.......
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PCB Train Single & Double sided PTH 4-6-8 Layers
Laminate thickness & type 1.6mm FR4,
0.8mm FR4
1.6mm FR4
1 oz Cu thickness, outers (start thickness before plating) 18 microns 18 microns
1 oz Cu thickness, outers (finish thickness after plating) 35 microns 35 microns
2 oz Cu thickness, outers (start thickness before plating) 70 microns n/a
2 oz Cu thickness, outers (finish thickness after plating) 87 microns n/a
Copper thickness (inner-cores), start = finish thickness n/a 35 microns
Solder resists (photo-image) Green x 2 Green x 2
Legend White x 2 White x 2
Nos. of holes No limit No limit

Min finished hole size after Cu plate (0.8mm and 1.6mm laminate)

Min finished hole size after Cu plate (2.4mm laminate)

0.20mm

0.30mm

 0.20mm

n/a

Profile complexity No limit No limit
Surface Finish Immersion Silver (optionally Au/Ni on some services)
Immersion Silver (optionally Au/Ni on some services)
Gold (electrolytic) n/a n/a
Electrical test Included Included
Min track & gap (35 micron / 1oz Cu thickness) 0.125mm 0.125mm
Min track & gap (70 micron / 2oz Cu thickness) 0.250mm n/a
Solder resist to copper pad clearance 0.125mm 0.125mm
Copper pad to hole 0.125mm 0.125mm
Copper track to copper plane clearance within a ground plane 0.125mm 0.125mm
Minimum board size 10mm x 10mm 10mm x 10mm
Maximum board size 550mm x 400mm 550mm x 400mm
Mechanical No scoring.
No chamfering.
No countersinking.
No rebating.
2.0mm standard router.
No scoring.
No chamfering.
No countersinking.
No rebating.
2.0mm standard router.

Legend text line width

Legend character height

Legend to copper pad clearance

50 micron minimum, 150 micron typical

0.5mm minimum

50 micron minimum, 125 micron typical

50 micron minimum, 150 micron typical

0.5mm minimum 

50 micron minimum

Drill hole to copper clearance (inner layer) 0.5mm min. 0.5mm min.

Mechanical edge to copper track clearance

Profile tolerance

0.25mm min.

+/- 0.2mm 

0.25mm min.

+/- 0.2mm 

Dielectric constant (Dk) of FR4 cores
Dielectric constant (Dk) of FR4 prepregs
4.55
4.2
4.55
4.2
4 Layer 0.8 mm overall thickness M/L construction "Z" axis spacing of copper layers (4 layers)   1-2  0.22mm
2-3  0.20mm
3-4  0.22mm
4 Layer 1.6 mm overall thickness M/L construction "Z" axis spacing of copper layers (4 layers)   1-2  0.22mm
2-3  0.99mm
3-4  0.22mm
6 Layer 1.6mm overall thickness M/L construction "Z" axis spacing of copper layers (6 layers)   1-2  0.22mm
2-3  0.30mm
3-4  0.22mm
4-5  0.30mm
5-6  0.22mm

 

 

 

 

8 Layer 1.6 mm overall thickness M/L construction "Z" axis spacing of copper layers (8 layers)

 

 

 

Overall thickness tolerance

 

 

 

 

 

 

 

 

+ / - 10 %

1-2 0.22mm

2-3 0.2mm

3-4 0.22mm

4-5 0.2mm

5-6 0.22mm

6-7 0.2mm

7-8 0.22mm

 

+ / - 10 %

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