| PCB Train | Single & Double sided PTH | 4-6-8 Layers |
|---|---|---|
| Laminate thickness & type | 1.6mm FR4, 0.8mm FR4 |
1.6mm FR4 |
| 1 oz Cu thickness, outers (start thickness before plating) | 18 microns | 18 microns |
| 1 oz Cu thickness, outers (finish thickness after plating) | 35 microns | 35 microns |
| 2 oz Cu thickness, outers (start thickness before plating) | 70 microns | n/a |
| 2 oz Cu thickness, outers (finish thickness after plating) | 87 microns | n/a |
| Copper thickness (inner-cores), start = finish thickness | n/a | 35 microns |
| Solder resists (photo-image) | Green x 2 | Green x 2 |
| Legend | White x 2 | White x 2 |
| Nos. of holes | No limit | No limit |
|
Min finished hole size after Cu plate (0.8mm and 1.6mm laminate) |
0.20mm |
0.20mm |
|
Min finished hole size after Cu plate (2.4mm laminate only) |
0.30mm |
n/a |
|
Min finished hole size (1.5mm thick aluminium base only) |
0.60mm |
n/a |
| Profile complexity | No limit | No limit |
| Surface Finish | Immersion Silver (optionally Au/Ni on some services) | Immersion Silver (optionally Au/Ni on some services) |
| Gold (electrolytic) | n/a | n/a |
| Electrical test | Included | Included |
| Min track & gap (35 micron / 1oz Cu thickness) | 0.125mm | 0.125mm |
| Min track & gap (70 micron / 2oz Cu thickness) | 0.250mm | n/a |
| Solder resist to copper pad clearance | 0.125mm | 0.125mm |
| Copper pad to hole | 0.125mm | 0.125mm |
|
Copper track to copper plane clearance within a ground plane (35 micron / 1oz Cu thickness) Copper track to copper plane clearance within a ground plane (70 micron / 2oz Cu thickness) |
0.125mm
0.250mm |
0.125mm
0.250mm |
| Minimum board size | 10mm x 10mm | 10mm x 10mm |
| Maximum board size | 550mm x 400mm | 550mm x 400mm |
| Mechanical | No scoring. No chamfering. No countersinking. No rebating. 2.0mm standard router. |
No scoring. No chamfering. No countersinking. No rebating. 2.0mm standard router. |
|
Legend text line width Legend character height Legend to copper pad clearance |
50 micron minimum, 150 micron typical 0.5mm minimum 50 micron minimum, 125 micron typical |
50 micron minimum, 150 micron typical 0.5mm minimum 50 micron minimum |
| Drill hole to copper clearance (inner layer) | 0.5mm min. | 0.5mm min. |
|
Mechanical edge to copper track clearance Profile tolerance |
0.25mm min. +/- 0.2mm |
0.25mm min. +/- 0.2mm |
| Dielectric constant (Dk) of FR4 cores Dielectric constant (Dk) of FR4 prepregs |
4.55 4.2 |
4.55 4.2 |
| 4 Layer 0.8 mm overall thickness M/L construction "Z" axis spacing of copper layers (4 layers) | 1-2 0.22mm 2-3 0.20mm 3-4 0.22mm |
|
| 4 Layer 1.6 mm overall thickness M/L construction "Z" axis spacing of copper layers (4 layers) | 1-2 0.22mm 2-3 0.99mm 3-4 0.22mm |
|
| 6 Layer 1.6mm overall thickness M/L construction "Z" axis spacing of copper layers (6 layers) | 1-2 0.22mm 2-3 0.30mm 3-4 0.33mm 4-5 0.30mm 5-6 0.22mm |
|
|
8 Layer 1.6 mm overall thickness M/L construction "Z" axis spacing of copper layers (8 layers)
Overall thickness tolerance |
+ / - 10 % |
1-2 0.22mm 2-3 0.2mm 3-4 0.22mm 4-5 0.2mm 5-6 0.22mm 6-7 0.2mm 7-8 0.22mm
+ / - 10 % |
| If your requirements exceed PCB Train specifications | Ask us to quote | Ask us to quote |